Substrate stiffness affects particle distribution pattern in a drying suspension droplet

R. Iqbal; Atsushi Matsumoto; A. Sudeepthi; Amy Q. Shen; A. K. Sen

doi:10.1063/1.5097620

Substrate stiffness affects particle distribution pattern in a drying suspension droplet

R. Iqbal, Atsushi Matsumoto, A. Sudeepthi, Amy Q. Shen, A. K. Sen

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13 Scopus citations

Abstract

The complexities involved in achieving a tailor-made evaporative deposition pattern have remained a challenge. Here, we show that the morphological pattern of drying suspension droplets can be altered by varying substrate elastic modulus E. We find that the particle spot diameter and spacing between the particles scale with substrate stiffness as d s ∼ E - 0.15 and s ∼ E - 1.23, respectively. We show that the larger spot diameter and spacing between particles on a softer substrate are attributed to a higher energy barrier U associated with stronger pinning of the contact line. The particle deposition pattern is characterized in terms of deposition index, I d, whose value is < 0.50 and >0.75 for centralized (multilayer) and uniform (monolayer) deposition patterns observed for stiffer and softer substrates, respectively. The outcome of the present study may find applications in biochemical characterization and analysis of micro-/nanoparticles.

Original language	English (US)
Article number	253701
Journal	Applied Physics Letters
Volume	114
Issue number	25
DOIs	https://doi.org/10.1063/1.5097620
State	Published - Jun 24 2019

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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10.1063/1.5097620

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title = "Substrate stiffness affects particle distribution pattern in a drying suspension droplet",

abstract = "The complexities involved in achieving a tailor-made evaporative deposition pattern have remained a challenge. Here, we show that the morphological pattern of drying suspension droplets can be altered by varying substrate elastic modulus E. We find that the particle spot diameter and spacing between the particles scale with substrate stiffness as d s ∼ E - 0.15 and s ∼ E - 1.23, respectively. We show that the larger spot diameter and spacing between particles on a softer substrate are attributed to a higher energy barrier U associated with stronger pinning of the contact line. The particle deposition pattern is characterized in terms of deposition index, I d, whose value is < 0.50 and >0.75 for centralized (multilayer) and uniform (monolayer) deposition patterns observed for stiffer and softer substrates, respectively. The outcome of the present study may find applications in biochemical characterization and analysis of micro-/nanoparticles.",

author = "R. Iqbal and Atsushi Matsumoto and A. Sudeepthi and Shen, {Amy Q.} and Sen, {A. K.}",

note = "Funding Information: This work was carried out under the exchange program at the Okinawa Institute of Science and Technology Graduate University (OIST), Japan, under the joint supervision of A.K.S. (IIT Madras) and A.Q.S. (OIST). R.I. would like to acknowledge the financial support provided by OIST during the internship. R.I. would also like to acknowledge the Micro/Bio/Nanofluidics unit at OIST for the facilities provided. R.I. thanks Mr. Kei Funakoshi and Mr. Kazumi Toda Peters for assistance during the experiments. R.I. also thanks Ms. Noriko Ishizu from OIST and the Department of Mechanical Engineering, IIT Madras, for assisting with the SEM images. A.K.S. acknowledges funding support from IIT Madras via Project No. MEE1516843RFTPASHS. A.Q.S. acknowledges funding from the Japan Society for the Promotion of Science (Grants-in-Aid for Scientific Research (B), Grant No. 18H01135, and Grants-in Aid for Scientific Research (C), Grant No. 17K06173). Publisher Copyright: {\textcopyright} 2019 Author(s).",

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AU - Matsumoto, Atsushi

AU - Sudeepthi, A.

AU - Shen, Amy Q.

AU - Sen, A. K.

N1 - Funding Information: This work was carried out under the exchange program at the Okinawa Institute of Science and Technology Graduate University (OIST), Japan, under the joint supervision of A.K.S. (IIT Madras) and A.Q.S. (OIST). R.I. would like to acknowledge the financial support provided by OIST during the internship. R.I. would also like to acknowledge the Micro/Bio/Nanofluidics unit at OIST for the facilities provided. R.I. thanks Mr. Kei Funakoshi and Mr. Kazumi Toda Peters for assistance during the experiments. R.I. also thanks Ms. Noriko Ishizu from OIST and the Department of Mechanical Engineering, IIT Madras, for assisting with the SEM images. A.K.S. acknowledges funding support from IIT Madras via Project No. MEE1516843RFTPASHS. A.Q.S. acknowledges funding from the Japan Society for the Promotion of Science (Grants-in-Aid for Scientific Research (B), Grant No. 18H01135, and Grants-in Aid for Scientific Research (C), Grant No. 17K06173). Publisher Copyright: © 2019 Author(s).

PY - 2019/6/24

Y1 - 2019/6/24

N2 - The complexities involved in achieving a tailor-made evaporative deposition pattern have remained a challenge. Here, we show that the morphological pattern of drying suspension droplets can be altered by varying substrate elastic modulus E. We find that the particle spot diameter and spacing between the particles scale with substrate stiffness as d s ∼ E - 0.15 and s ∼ E - 1.23, respectively. We show that the larger spot diameter and spacing between particles on a softer substrate are attributed to a higher energy barrier U associated with stronger pinning of the contact line. The particle deposition pattern is characterized in terms of deposition index, I d, whose value is < 0.50 and >0.75 for centralized (multilayer) and uniform (monolayer) deposition patterns observed for stiffer and softer substrates, respectively. The outcome of the present study may find applications in biochemical characterization and analysis of micro-/nanoparticles.

AB - The complexities involved in achieving a tailor-made evaporative deposition pattern have remained a challenge. Here, we show that the morphological pattern of drying suspension droplets can be altered by varying substrate elastic modulus E. We find that the particle spot diameter and spacing between the particles scale with substrate stiffness as d s ∼ E - 0.15 and s ∼ E - 1.23, respectively. We show that the larger spot diameter and spacing between particles on a softer substrate are attributed to a higher energy barrier U associated with stronger pinning of the contact line. The particle deposition pattern is characterized in terms of deposition index, I d, whose value is < 0.50 and >0.75 for centralized (multilayer) and uniform (monolayer) deposition patterns observed for stiffer and softer substrates, respectively. The outcome of the present study may find applications in biochemical characterization and analysis of micro-/nanoparticles.

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Substrate stiffness affects particle distribution pattern in a drying suspension droplet

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