Microcontact printing and pattern transfer using trichlorosilanes on oxide substrates

Pamela M. St. John, Harold G. Craighead

Research output: Contribution to journalArticlepeer-review

23 Scopus citations

Abstract

Microcontact printing was used to pattern silicon, aluminum, and titanium substrates using octadecyltrichlorosilane as the ink and an elastomer as the stamp. Patterns were transferred into the substrates using both dry and wet etching. The Al and Ti were etched using an electron cyclotron resonance (ECR) plasma source at low ion energies and low pressure. Silicon was etched in HF to remove the native oxide, followed by KOH. Microcontact printing using OTS ink is a convenient and easy way to pattern both semiconductor and metal surfaces without the extended use of photolithography.

Original languageEnglish (US)
Pages (from-to)1022-1024
Number of pages3
JournalApplied Physics Letters
Volume68
Issue number7
DOIs
StatePublished - Feb 12 1996

Keywords

  • ALUMINIUM
  • ECR HEATING
  • ETCHING
  • LITHOGRAPHY
  • MASKING
  • PLASMA
  • SILICON
  • SURFACE STRUCTURE
  • TITANIUM

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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