Metal deposition by electron beam exposure of an organometallic film

H. G. Craighead; L. M. Schiavone

doi:10.1063/1.96823

Metal deposition by electron beam exposure of an organometallic film

H. G. Craighead, L. M. Schiavone

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Abstract

We describe a method of metal deposition by electron beam exposure and pyrolysis of a gold containing organometallic polymer. Commercial gold containing solutions were used as negative electron beam resists with line dose sensitivities of about 0.2 μC/cm as developed in methylene chloride. We have demonstrated the formation of metal patterns on Si, GaAs, and polyimide with linewidths as small as 0.25 μm.

Original language	English (US)
Pages (from-to)	1748-1750
Number of pages	3
Journal	Applied Physics Letters
Volume	48
Issue number	25
DOIs	https://doi.org/10.1063/1.96823
State	Published - 1986

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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@article{a863dd6bab4e46d0beca7216a79c036e,

title = "Metal deposition by electron beam exposure of an organometallic film",

abstract = "We describe a method of metal deposition by electron beam exposure and pyrolysis of a gold containing organometallic polymer. Commercial gold containing solutions were used as negative electron beam resists with line dose sensitivities of about 0.2 μC/cm as developed in methylene chloride. We have demonstrated the formation of metal patterns on Si, GaAs, and polyimide with linewidths as small as 0.25 μm.",

author = "Craighead, {H. G.} and Schiavone, {L. M.}",

year = "1986",

doi = "10.1063/1.96823",

language = "English (US)",

volume = "48",

pages = "1748--1750",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "American Institute of Physics Publising LLC",

number = "25",

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TY - JOUR

T1 - Metal deposition by electron beam exposure of an organometallic film

AU - Craighead, H. G.

AU - Schiavone, L. M.

PY - 1986

Y1 - 1986

N2 - We describe a method of metal deposition by electron beam exposure and pyrolysis of a gold containing organometallic polymer. Commercial gold containing solutions were used as negative electron beam resists with line dose sensitivities of about 0.2 μC/cm as developed in methylene chloride. We have demonstrated the formation of metal patterns on Si, GaAs, and polyimide with linewidths as small as 0.25 μm.

AB - We describe a method of metal deposition by electron beam exposure and pyrolysis of a gold containing organometallic polymer. Commercial gold containing solutions were used as negative electron beam resists with line dose sensitivities of about 0.2 μC/cm as developed in methylene chloride. We have demonstrated the formation of metal patterns on Si, GaAs, and polyimide with linewidths as small as 0.25 μm.

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U2 - 10.1063/1.96823

DO - 10.1063/1.96823

M3 - Article

AN - SCOPUS:0001408387

VL - 48

SP - 1748

EP - 1750

JO - Applied Physics Letters

JF - Applied Physics Letters

SN - 0003-6951

IS - 25

ER -

Metal deposition by electron beam exposure of an organometallic film

Abstract

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