Laser micromachining of optical biochips

Andrew D. Goater, Julian P H Burt, David J. Morris, Anoop Menachery, Nadeem H. Rizvi, Daniel R. Matthews, Huw D. Summers

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Optical biochips may incorporate both optical and microfluidic components as well as integrated light emitting semiconductor devices. They make use of a wide range of materials including polymers, glasses and thin metal films which are particularly suitable if low cost devices are envisaged. Precision laser micromachining is an ideal flexible manufacturing technique for such materials with the ability to fabricate structures to sub-micron resolutions and a proven track record in manufacturing scale up. Described here is the manufacture of a range of optical biochip devices and components using laser micromachining techniques. The devices employ both microfluidics and electrokinetic processes for biological cell manipulation and characterization. Excimer laser micromachining has been used to create complex microelectrode arrays and microfluidic channels. Excimer lasers have also been employed to create on-chip optical components such as microlenses and waveguides to allow integrated vertical and edge emitting LEDs and lasers to deliver light to analysis sites within the biochips. Ultra short pulse lasers have been used to structure wafer level semiconductor light emitting devices. Both surface patterning and bulk machining of these active wafers while maintaining functionality has been demonstrated. Described here is the use of combinations of ultra short pulse and excimer lasers for the fabrication of structures to provide ring illumination of in-wafer reaction chambers. The laser micromachining processes employed in this work require minimal post-processing and so make them ideally suited to all stages of optical biochip production from development through to small and large volume production.

Original languageEnglish (US)
Title of host publicationLaser-based Micro- and Nanopackaging and Assembly
DOIs
StatePublished - 2007
EventLaser-based Micro- and Nanopackaging and Assembly - San Jose, CA, United States
Duration: Jan 22 2007Jan 24 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6459
ISSN (Print)0277-786X

Other

OtherLaser-based Micro- and Nanopackaging and Assembly
Country/TerritoryUnited States
CitySan Jose, CA
Period1/22/071/24/07

Keywords

  • Electrokinetics
  • Excimer
  • Femtosecond
  • Laser micromachining
  • Optical biochip
  • Ultra short pulse

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

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