High Fidelity Tape Transfer Printing Based On Chemically Induced Adhesive Strength Modulation

Kyoseung Sim, Song Chen, Yuhang Li, Mejdi Kammoun, Yun Peng, Minwei Xu, Yang Gao, Jizhou Song, Yingchun Zhang, Haleh Ardebili, Cunjiang Yu

Research output: Contribution to journalArticlepeer-review

21 Scopus citations

Abstract

Transfer printing, a two-step process (i.e. picking up and printing) for heterogeneous integration, has been widely exploited for the fabrication of functional electronics system. To ensure a reliable process, strong adhesion for picking up and weak or no adhesion for printing are required. However, it is challenging to meet the requirements of switchable stamp adhesion. Here we introduce a simple, high fidelity process, namely tape transfer printing(TTP), enabled by chemically induced dramatic modulation in tape adhesive strength. We describe the working mechanism of the adhesion modulation that governs this process and demonstrate the method by high fidelity tape transfer printing several types of materials and devices, including Si pellets arrays, photodetector arrays, and electromyography (EMG) sensors, from their preparation substrates to various alien substrates. High fidelity tape transfer printing of components onto curvilinear surfaces is also illustrated.

Original languageEnglish (US)
Article number16133
JournalScientific Reports
Volume5
DOIs
StatePublished - Nov 10 2015

ASJC Scopus subject areas

  • General

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