Effects of air on enclosure design of lead-zirconate-titanate (pzt) thin-film diaphragm microactuators

Chuan Luo, Kai Yi Hsiao, Perry Cheung, Howard Lin, Amy Q. Shen, G. Z. Cao, I. Y. Shen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we evaluate performance of two types of piezoelectric diaphragm micro-actuators: open-end design and closed-end design. In the open-end design, the micro-actuator consists of a base silicon diaphragm, a layer of bottom electrode, a layer of lead-zirconate-titanate (PZT) thin film, and a layer of top electrode. The diaphragm is anchored on a silicon substrate by etching the silicon substrate from the back to form a cavity under the diaphragm. In the closed-end design, the bottom of the cavity is sealed with a piece of glass, silicon or PDMS. Experimental results show that the measured displacements from the closed-end design are always 5%-30% lower than those from the open-end design. To explain the experimental results, we hypothesize that the air inside the cavity of the closed-end design behaves like an elastic spring increasing the stiffness of the closed-end design. To confirm the hypothesis, we estimate the stiffness of the air by modeling the air as an ideal gas with a constant temperature. We also.

Original languageEnglish (US)
Title of host publicationASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012
Pages41-47
Number of pages7
Volume5
DOIs
StatePublished - Dec 1 2012
EventASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012 - Chicago, IL, United States
Duration: Aug 12 2012Aug 12 2012

Other

OtherASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012
CountryUnited States
CityChicago, IL
Period8/12/128/12/12

ASJC Scopus subject areas

  • Modeling and Simulation
  • Mechanical Engineering
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

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