Abstract
Two brain signal acquisition (BSA) front-ends incorporating two CMOS ultralow power, low-noise amplifier arrays and serializers operating in mosfet weak inversion region are presented. To boost the amplifier's gain for a given current budget, cross-coupled-pair active load topology is used in the first stages of these two amplifiers. These two BSA front-ends are fabricated in 130 and 180 nm CMOS processes, occupying 5.45 mm $^{2}$ and 0.352 mm $^{2}$ of die areas, respectively (excluding pad rings). The CMOS 130-nm amplifier array is comprised of 64 elements, where each amplifier element consumes 0.216 μ W from 0.4 V supply, has input-referred noise voltage (IRNoise) of 2.19 μV RMS corresponding to a power efficiency factor (PEF) of 11.7, and occupies 0.044 mm $^{2}$ of die area. The CMOS 180 nm amplifier array employs 4 elements, where each element consumes 0.69 μ W from 0.6 V supply with IRNoise of 2.3 μ V RMS (corresponding to a PEF of 31.3) and 0.051 mm 2 of die area. Noninvasive electroencephalographic and invasive electrocorticographic signals were recorded real time directly on able-bodied human subjects, showing feasibility of using these analog front-ends for future fully implantable BSA and brain- computer interface systems.
| Original language | English (US) |
|---|---|
| Article number | 7999268 |
| Pages (from-to) | 1111-1122 |
| Number of pages | 12 |
| Journal | IEEE Transactions on Biomedical Circuits and Systems |
| Volume | 11 |
| Issue number | 5 |
| DOIs | |
| State | Published - Oct 2017 |
Keywords
- Analog front-end (AFE)
- CMOS
- electrocorticography (ECoG)
- electroencephalogram (EEG)
- instrumentation amplifier (InAmp)
- noise efficiency factor (NEF)
- operational transconductance amplifier (OTA)
- power efficiency factor (PEF)
- ultra-low power (ULP)
- weak inversion (WI) region
ASJC Scopus subject areas
- Biomedical Engineering
- Electrical and Electronic Engineering
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